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Index : PCB Library : PCB Manufacturing Capabilities
Below are the PCBpro PCB Manufacturing Capabilities. For a definition of terms and more information (underlined text), check out our PCB Glossary. Accepted "PCBpro.com" file formats: Gerber with Excellon Drill file. All files should be sent in a zip-format. A readme file is recommended.

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Information highlighted in BLUE should be in the board layout design to ensure a working board.

Category Description PCBpro Capability
Files can be

Gerber files - preferred format 274-X ( embedded apertures )
Gerber files - acceptable format 274-D, with one aperture list
Gerber files - extra cost possible 274-D, with multiple aperture lists
Excellon drill file X & Y coordinates, with tool sizes included.
Material is FR4
Bow and twist 0.0075"
Dielectric spacing 0.005" min
Starting thickness within +/- 0.007"
Layer Registration Layer to layer within .010" ( +/- .005" each layer)
Copper Plating Minimum in holes 0.0008"
Minimum on surface 0.0008"
Inner layers Minimum clearances Hole size + .025"
Minimum back set Copper .025" from cut line
Minimum pad size Hole size + .018"
Minimum traces and spacing As per order form (ex. 0.006" with 1-oz. copper)
Outer layer Minimum back set Copper .010" from cut line
Minimum pad size (non-via) Hole size + .017"
Minimum via pad size Hole size + 0.010"
Minimum traces and spacing As per order form (ex. 0.006" with 1-oz. copper)
Multi Layers 1-4 layers 0.031", 0.047", 0.062", 0.093", & 0.125" Thickness
1,1.5, & 2.5oz Finished Copper Weight
5-8 layers 0.062",.093", &.125" Thickness
1,1.5, & 2.5oz Finished Copper Weight
Traces Finished trace size Within 20% of artwork
Trace size .006"-.009" 1 oz, Finished Copper Weight
Trace size .010"-.013" 1, & 1.5oz, Finished Copper Weight
Trace size > .013" 1,1.5, & 2.5oz Finished Copper Weight
Solder Finish/Holes Hot Air Leveling (used with solder mask) 0.0001"- .0015"
Reflow (used without solder mask)  
Solder filled holes Holes drilled less than .020” may be plugged
Solder mask Mask registration tolerance Within +/- .005"
Nominal thickness 0.0004"
Mask film clearance Pad size + smallest board spacing
Silkscreen Marking / text  +/- .010" registration
Min. 0.007" line required to be visible on board
Electrical Testing Continuity 10-50 ohm (50 ohm std.)
Isolation 10-100 Mohm (10 Mohm std.)
Voltage 10-250V (100 V std.)
Minimum SMT pitch 0.020"
Drilling Sizes from 0.010"-0.016" (0 .010" our min.) 0.031", 0.047", 0.062", thickness
Sizes from 0017"-0.019" 0.031", 0.047", 0.062", & 0.093" thickness
Sizes > 0.019" 0.031", 0.047", 0.062", 0.093", & 0.125" thickness
Finished hole size Within +/- 0.004" of drill file sizes
True position 0.005"
Board Routing Tolerance board edge & cutouts Within +/- .010"
Maximum board size 14" X 18"
Minimum board size 0.25" X .25"
Tab Routing Space between boards 0.1", you send a one up image, we do the rest.
  Boarder around pallet 0.5"
  Number of tabs per board 4
  Overall panel size (view sample) Varies with board size, approx. 12" x 14"
V-Scoring (30 degree) Space between boards 0.0"
  Boarder around pallet 0.5"
  Overall panel size (view sample) Varies with board size, approx. 12" x 14"
  Minimum Board Size 1.5" x 1.5"
  Minimum back set Copper 0.030" from cutline
Gold fingers (30 degree) Gold plated edge connectors (30 d bevel) 30 micro inch Au, over 100 microinch Ni minimum
Standards IPC-600 Pictorial guide We use Class II to determine defects
  UL (Underwriters Laboratory) When selected on order form

Rev. 1020050211-2

 

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